Online/offline high-resolution 2D X-ray and 3D computed tomography (CT) inspection with electronic product production lines and R&D labs for real-time X-ray inspection system Non-destructive fault analysis in solder joints, bonding wires, voids analysis
With the Intelligentization and informatization developments and continuous innovation, electronic components are becoming increasingly miniaturized and complex, the update speed of electronic products has been increasing day by day.
From smart phones and computers to electric vehicles and aircraft, solder joints, semiconductor packaging and electronic components are crucial to many important devices, it is particularly important to detect the tiniest flaws in solder joints, bonding wires and soldering areas, conductive and non-conductive chip soldering, capacitors and inductors, as well as assembled products.
Non-destructive fault analysis and production process control methods in various industrial and scientific fields invited powerful nanofocus and microfocus X-ray technologies.
X-ray technologies directly introduces high-resolution 2D X-ray and 3D computed tomography (CT) inspection into electronics production lines and R&D laboratories for real-time monitoring and inspection, thereby ensuring the safety and integrity of components.
Printed Circuit Board Assembly(PCBA)
Missing solder fillets
Voids, blisters
Solder bridges
Non-wetting defects
Semiconductors and electronics
Automated solder joint inspection
Bond wire and bonding areas inspection
Void analysis of conductive and non-conductive die bonds
Discrete components analysis for capacitors and inductors
Assembly inspection even for finished devices or encapsulated components
Others
Assembly quality control
Manufacturing process optimization
Failure analysis
Solder joint quality
